Product Description
Tungsten (molybdenum) copper alloys produced by sintering and infiltrating methods have good conductivity, good machining property, high tensile strength in elevated temperature, high fracture toughness, high ablation resistance and low thermal expansion modulus. W-Cu, Mo-Cu alloys are widely used in astronautic, aeronautic, electric and electronic, spark machining and metallurgy industry.
CISRI-AT&M have developed a high temperature sintering and infiltrating process for the manufacture of tungsten (molybdenum)-copper alloys. Only high purity raw materials are used and there are no lubricants or sintering aides added during processing. The thermal expansion coefficient and the thermal and electric conductivity can be tuned by the varying of component of the tungsten-copper alloys. Two phases or three phases tungsten (molybdenum) copper alloys which the copper content varies from 5% to 95% can be provided by CISRI- AT&M.
CISRI-AT&M can produce various big size W-Cu parts by CIP, various small parts by mold pressing, extruding or MIM, various thickness plates by rolling.
1.High performance alloys used in spaceflight field
Tungsten-Copper alloys have such excellent characteristics as heat-resistant, ablate-resistant, high intensity, high density and self-cooling quality, which make them widely used in spaceflight field. Our company has been researching and producing Tungsten-Copper alloys in spaceflight field for 45 years and we had won the national second prize of invention and national secrecy patent in this field.
2.Electrical Contact materials
Our tungsten-Copper alloys have the unique advantages of without other element except tungsten and copper, uniform composition, low content of gas and impurity, high burn-off resistance, excellent thermal and electrical conductivity, compact copper layer, etc., which make them widely used by many Chinese and international companies. More than ten thousands throughput can meet various demands.
3. Electrodes for Spark Erosion
Our W-Cu electrodes are most suitable for EDM machining of cemented carbide materials.
Advantages: high electric corrosion speed, low wear rate, high contour sharpness, good machinability, good surface quality.
Types of product: rods, tubes and plates.
4. Electronics Packaging and Heat Sink Materials
Electronics Packaging Materials with excellent dimensional stability, thermal uniformity and flatness applicable to optoelectronic applications can be offered by AT&M with the advantages such as high thermal and electric conductivity, different thermal expansion coefficient match with different matrixes, excellent thermal stability in elevated temperature and excellent machinability.
Typical Properties of Tungsten Copper
Material Composition(wt%) W-7Cu W-10CuW-15CuW-20CuW-25CuW-30Cu
Density(g/cm3) 17.5 17.0 16.2 15.4 14.7 14.1
TC(W/mK) 150 160 170 180 200 220
CTE (X10-6/K) 5.5 6.2 6.9 7.4 8.0 8.8
Bending strength(MPa) ≥850 ≥804 ≥765 ≥736 ≥706 ≥667
Size: Tube and Bar: Ø3-390mm x 500mm Max, plate: Width ≤390mm,Length ≤500mm
Typical Properties of Molybdenum Copper
Material Composition(wt%) Mo-10CuMo-15CuMo-20CuMo-25Cu
Density(g/cm3) 9.91 9.84 9.75 9.70
TC(W/mK) 150 160 170 180
CTE (X10-6/K) 5.6 6.7 7.4 8.5
Size: Tube and Bar: Ø3-390mm x 500mm Max, plate: Width ≤390mm,Length ≤500mm
Detailed Photos
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